Description:  The 200-micron-long filament in the center of this image is mountedabove the surface of a chip. When heat builds up in the filament the device snaps it down to touch the surface of the chip, which dissipates the heat.
Source:  University of Minnesota
Story:  Hitting the deck cools microdevices
TRN March 28/April 4, 2001
TRN Categories:  Microelectromechanical Systems (MEMS)
Form:  Still

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