The 200-micron-long filament in the center of this image is mountedabove the surface of a chip. When heat builds up in the filament the device snaps it down to touch the surface of the chip, which dissipates the heat.
University of Minnesota
Hitting the deck cools microdevices
TRN March 28/April 4, 2001
Microelectromechanical Systems (MEMS)
Newswire and Headline Feeds
for Web sites
© Copyright Technology Research News, LLC 2000-2008. All rights reserved.